BITS Pilani

  • Page last updated on Thursday, November 17, 2022


Innovate. Achieve. Lead.

Office Infrastructure

Office space of 4,500 SFT with 11 individual cabins/offices
• 35 individual work-stations, meeting room and conference room
• Biotech/Pharma lab of 2000SFT, with 5 individual lab spaces and a 1000 SFT common area and Common equipment's are industrial grade centrifuge, table top centrifuges, mammalian cell culture room, etc.
• MicroElectroMechanical Systems (MEMS) lab of 2650 SFT . Common equipment are high–end circuit design software, silicon wafer processing equipment such as spin coater, wet bench, probe station, thin-film depositor, etc.
• “ICT for Healthcare” lab of 1200 SFT has smart-phones for app development and diagnostics applications, high-end servers etc.
Common facilities like Photocopiers, Scanner, Fax machine, High speed internet, Printer, Telephone Line, Teleconferencing facilities, Meeting/Conference room with projection equipment.

  • Biotech Labspace

  • MEMS Lab

    MEMS Lab
    MEMS clean room with MEMS design S/W, automated thin film deposition system, spin coater, baking oven, wet bench, photolithography, furnace, etc.
    Thrust Area Equipment Lab Facility
    • Highend Servers and workstations for ASIC design
    • Tablet PCs/Smartphones for Telemedicine (android/windows)
    • Desktop PCs for telemedicine software development
    • PDK and cost of chip fabrication
    • ARM-based Development Boards and Tools for mobile diagnostics
    • Logic Analyzer for IC testing
    • Spectrum Analyzer for IC function
    • Automated Thin Film deposition system
    • Furnace with 4 tubes and temperature controller for MEMS
    • Spin coater
    • Baking oven (MEMS)
    • Wet Clean station with Fume hood
    • Probe Station
    • Photolithography equipment
    • Polymer molding facility
    • Liquid nitrogen plant
    • BS2 sterile room
    • Industry scale centrifuge 

  • 3D Printing Zone

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    An Institution Deemed to be University estd. vide Sec.3 of the UGC Act,1956 under notification # F.12-23/63.U-2 of Jun 18,1964

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